Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5913979 | Method for removing spin-on-glass at wafer edge | Hui-Tzu Lin | 1999-06-22 |
| 5783097 | Process to avoid dielectric damage at the flat edge of the water | Chi-Shen Lo, Chao-Hsin Chang, Chia-Hsiang Chen, Hsien-Wen Chang | 1998-07-21 |
| 5747383 | Method for forming conductive lines and stacked vias | Li-Chun Chen | 1998-05-05 |
| 5723385 | Wafer edge seal ring structure | Hui-Tzu Lin | 1998-03-03 |
| 5668401 | Chessboard pattern layout for scribe lines | Ying-Chen Chao | 1997-09-16 |
| 5591673 | Tungsten stud process for stacked via applications | Ying-Chen Chao, Yi-Dong Yan | 1997-01-07 |
| 5492868 | Capped reflow process to avoid contact autodoping and supress tungsten silicide peeling | Ting-Hao Lin, Chung-An Lin | 1996-02-20 |