Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777480 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2020-09-15 |
| 10515866 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2019-12-24 |
| 10204843 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Yen-Ming Peng, Han-Wei Yang | 2019-02-12 |
| 10157810 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2018-12-18 |
| 10014251 | Semiconductor device with self-protecting fuse and method of fabricating the same | Kang-Min Kuo, Yen-Ming Peng, Gwo-Chyuan Kuoh, Han-Wei Yang, Yi-Ruei Lin +4 more | 2018-07-03 |
| 9818666 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Yen-Ming Peng, Han-Wei Yang | 2017-11-14 |
| 9773716 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2017-09-26 |
| 9761486 | Method of chip packaging | Gwo-Chyuan Kuo, Han-Wei Yang | 2017-09-12 |
| 9472508 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Yen-Ming Peng, Han-Wei Yang | 2016-10-18 |
| 9412866 | BEOL selectivity stress film | Gwo-Chyuan Kuoh, Kang-Min Kuo, Bor-Zen Tien, Yen-Ming Peng | 2016-08-09 |
| 9406559 | Semiconductor structure and method for forming the same | Han-Wei Yang, Song-Bor Lee | 2016-08-02 |
| 9349688 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2016-05-24 |
| 9299621 | Smart measurement techniques to enhance inline process control stability | Han-Wei Yang, Yi-Ruei Lin, Kang-Min Kuo, Bor-Zen Tien | 2016-03-29 |
| 9299658 | Semiconductor device with self-protecting fuse and method of fabricating the same | Kang-Min Kuo, Yen-Ming Peng, Gwo-Chyuan Kuoh, Han-Wei Yang, Yi-Ruei Lin +4 more | 2016-03-29 |
| 9252047 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Yen-Ming Peng, Han-Wei Yang | 2016-02-02 |
| 9093373 | Conductive diffusion barrier structure for ohmic contacts | Chin-Chia Chang, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2015-07-28 |
| 9093528 | Stress compensation layer to improve device uniformity | Yen-Ming Peng, Kang-Min Kuo, Bor-Zen Tien | 2015-07-28 |
| 9076804 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2015-07-07 |
| 9070687 | Semiconductor device with self-protecting fuse | Kang-Min Kuo, Yen-Ming Peng, Gwo-Chyuan Kuoh, Han-Wei Yang, Yi-Ruei Lin +4 more | 2015-06-30 |