Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289587 | Trench power semiconductor component and method of manufacturing the same | — | 2022-03-29 |
| 11049950 | Trench power seminconductor device and manufacturing method thereof | — | 2021-06-29 |
| 11049958 | Semiconductor power device and manufacturing method thereof | Sung-Nien Tang, Ho-Tai Chen | 2021-06-29 |
| 10680076 | Trench power semiconductor and method of making the same | Chun-Ying Yeh, Yuan-Ming Lee | 2020-06-09 |
| 10629452 | Manufacturing method of a chip package structure | Chih-Cheng Hsieh | 2020-04-21 |
| 10559674 | Manufacturing method of a trench power semiconductor device | Chun-Ying Yeh, Chun-Wei Ni, Yuan-Ming Lee | 2020-02-11 |
| 10529847 | Trench power semiconductor component and method of manufacturing the same | — | 2020-01-07 |
| 10516027 | Trench power semiconductor and method of making the same | Chun-Ying Yeh, Yuan-Ming Lee | 2019-12-24 |
| 10497782 | Trench power semiconductor component and method of manufacturing the same | Chun-Ying Yeh, Chun-Wei Ni | 2019-12-03 |
| 10446658 | Trench power semiconductor device and manufacturing method thereof | — | 2019-10-15 |
| 10381268 | Fan-out wafer level chip package structure | Chih-Cheng Hsieh | 2019-08-13 |
| 10014369 | Super-junction semiconductor device | Sung-Nien Tang, Ho-Tai Chen | 2018-07-03 |
| 9947551 | Chip package structure and manufacturing method thereof | Chih-Cheng Hsieh | 2018-04-17 |
| 9881897 | Manufacturing method of ultra-thin semiconductor device package assembly | Chih-Cheng Hsieh | 2018-01-30 |
| 9876106 | Trench power transistor structure and manufacturing method thereof | — | 2018-01-23 |
| 9837508 | Manufacturing method of trench power MOSFET | — | 2017-12-05 |
| 9799563 | Fan-out wafer level chip package structure and manufacturing method thereof | Chih-Cheng Hsieh | 2017-10-24 |
| 9536972 | Trench power MOSFET and manufacturing method thereof | — | 2017-01-03 |
| 9349857 | Trench power MOSFET and manufacturing method thereof | — | 2016-05-24 |
| 9337049 | Manufacturing method of wafer level chip scale package structure | Chih-Cheng Hsieh | 2016-05-10 |
| 9299592 | Package structure and packaging method of wafer level chip scale package | Chih-Cheng Hsieh, Chun-Ying Yeh, Chung-Ming Leng | 2016-03-29 |
| 9130035 | Trench power MOSFET and manufacturing method thereof | — | 2015-09-08 |
| 9035378 | Trench power MOSFET structure fabrication method | Chun-Ying Yeh, Yuan-Ming Lee | 2015-05-19 |
| 8981485 | Power transistor having a top-side drain and forming method thereof | Chun-Ying Yeh, Yuan-Ming Lee | 2015-03-17 |
| 8900950 | Trench power MOSFET structure with high cell density and fabrication method thereof | — | 2014-12-02 |