Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12430869 | Image sensor and method of operating the same | Min-Yang Chiu | 2025-09-30 |
| 12400930 | Power module package | Hui-Chiang Yang, Chung-Ming Leng, Wei-Lun Wang | 2025-08-26 |
| 12048122 | Power module and power device | Chung-Ming Leng, Wei-Lun Wang | 2024-07-23 |
| 11785353 | Image sensor chip and sensing method thereof | Min-Yang Chiu | 2023-10-10 |
| 11770642 | Image sensor integrated with convolutional neural network computation circuit | Tzu-Hsiang Hsu | 2023-09-26 |
| 11683605 | Image sensor chip and sensing method thereof | Yen-Kai Chen, Tzu-Hsiang Hsu | 2023-06-20 |
| 11387180 | Power module including a carrier assembly with combination of circuit board and lead frame | Chung-Ming Leng | 2022-07-12 |
| 11048650 | Method and system for integrating processing-in-sensor unit and in-memory computing unit | Kea-Tiong Tang, Meng-Fan Chang, Syuan-Hao Sie | 2021-06-29 |
| 10742183 | Processing device for position sensing comprising a transforming differential current signal to a voltage signal performance | Chien-Wen Chen, You-Shin Chen | 2020-08-11 |
| 10668815 | Brake energy recovery module | — | 2020-06-02 |
| 10629452 | Manufacturing method of a chip package structure | Hsiu-Wen Hsu | 2020-04-21 |
| 10381268 | Fan-out wafer level chip package structure | Hsiu-Wen Hsu | 2019-08-13 |
| 10297522 | Semiconductor package structure and manufacturing method thereof | — | 2019-05-21 |
| 10043728 | Semiconductor package structure and manufacturing method thereof | — | 2018-08-07 |
| 9947551 | Chip package structure and manufacturing method thereof | Hsiu-Wen Hsu | 2018-04-17 |
| 9881897 | Manufacturing method of ultra-thin semiconductor device package assembly | Hsiu-Wen Hsu | 2018-01-30 |
| 9799563 | Fan-out wafer level chip package structure and manufacturing method thereof | Hsiu-Wen Hsu | 2017-10-24 |
| 9337049 | Manufacturing method of wafer level chip scale package structure | Hsiu-Wen Hsu | 2016-05-10 |
| 9299592 | Package structure and packaging method of wafer level chip scale package | Hsiu-Wen Hsu, Chun-Ying Yeh, Chung-Ming Leng | 2016-03-29 |
| 9029753 | Optical recognition system and method thereof | Shang-Fu Yeh, Chun-Kai Liu, Chiao-Jen Cheng | 2015-05-12 |
| 9007078 | Pixel array module with self-test function and method thereof | Shang-Fu Yeh, Ka-Yi Yeh | 2015-04-14 |
| 8729632 | Semiconductor structure with low resistance of substrate and low power consumption | Hsiu-Wen Hsu | 2014-05-20 |
| 8704580 | Circuit sharing time delay integrator | Chin-Fong Chiu, Hann-Huei Tsai, Wen-Hsu Chang, Kuo-Wei Cheng | 2014-04-22 |
| 7705367 | Pinned photodiode sensor with gate-controlled silicon-controlled rectifier transfer switch and method of formation | Chien-Chang Huang, Ching-Wei Chen | 2010-04-27 |
| 7436011 | CMOS image sensor | Ching-Wei Chen, Chien-Chang Huang | 2008-10-14 |