Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815107 | Method of etching surface layer portion of silicon wafer and method of analyzing metal contamination of silicon wafer | Jiahong WU | 2014-08-26 |
| 7601541 | Method for detecting Cu concentration of silicon substrate | Yoshikazu Shiina | 2009-10-13 |