Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7467990 | Back pressure control system for CMP and wafer polishing | — | 2008-12-23 | |
| 7059942 | Method of backgrinding wafers while leaving backgrinding tape on a chuck | Salman Kassir | 2006-06-13 | |
| 7008309 | Back pressure control system for CMP and wafer polishing | — | 2006-03-07 | |
| 6866564 | Method of backgrinding wafers while leaving backgrinding tape on a chuck | Salman Kassir | 2005-03-15 | $251,000 |
| 6696005 | Method for making a polishing pad with built-in optical sensor | — | 2004-02-24 | $377,000 |
| 6638389 | Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers | Salman Kassir | 2003-10-28 | $940,000 |
| 5449316 | Wafer carrier for film planarization | — | 1995-09-12 | |
| 5423716 | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied | — | 1995-06-13 |