| 10211059 |
Process for forming a layer of equiaxed titanium nitride and a MOSFET device having a metal gate electrode including a layer of equiaxed titanium nitride |
Florian Domengie, Carlos Augusto SUAREZ SEGOVIA, Aurelie Bajolet, Onintza Ros Bengoechea |
2019-02-19 |
| 9953837 |
Transistor having a gate comprising a titanium nitride layer and method for depositing this layer |
Sylvain Baudot |
2018-04-24 |
| 9691871 |
Process for forming a layer of equiaxed titanium nitride and a MOSFET device having a metal gate electrode including a layer of equiaxed titanium nitride |
Florian Domengie, Carlos Augusto SUAREZ SEGOVIA, Aurelie Bajolet, Onintza Ros Bengoechea |
2017-06-27 |
| 9536599 |
Optoelectronic device, in particular memory device |
Mickael Gros-Jean |
2017-01-03 |
| 9530489 |
Optoelectronic device, in particular memory device |
Mickael Gros-Jean |
2016-12-27 |
| 9257518 |
Method for producing a metal-gate MOS transistor, in particular a PMOS transistor, and corresponding integrated circuit |
Sylvain Baudot, Florian Domengie |
2016-02-09 |
| 9029254 |
Method for depositing a low-diffusion TiAlN layer and insulated gate comprising such a layer |
Florian Domengie, Sylvain Baudot |
2015-05-12 |
| 9000596 |
Transistors having a gate comprising a titanium nitride layer |
Sylvain Baudot |
2015-04-07 |
| 8053871 |
Implementation of a metal barrier in an integrated electronic circuit |
Laurin Dumas, Cécile Jenny |
2011-11-08 |
| 8018062 |
Production of a self-aligned CuSiN barrier |
Nicolas Casanova |
2011-09-13 |
| 8013284 |
Integrated electrooptic system |
Michael Gros-Jean |
2011-09-06 |
| 7851915 |
Electronic component comprising a titanium carbonitride (TiCN) barrier layer and process of making the same |
Rym Benaboud |
2010-12-14 |
| 7687399 |
Production of a self-aligned CuSiN barrier |
Nicolas Casanova |
2010-03-30 |
| 7667173 |
Integrated electrooptic system |
Michael Gros-Jean |
2010-02-23 |
| 7601636 |
Implementation of a metal barrier in an integrated electronic circuit |
Laurin Dumas, Cécile Jenny |
2009-10-13 |
| 7531447 |
Process for forming integrated circuit comprising copper lines |
Magali GREGOIRE |
2009-05-12 |