Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7595223 | Process for bonding and electrically connecting microsystems integrated in several distinct substrates | Ubaldo Mastromatteo, Daniela Morin, Marta Mottura, Mauro Marchi | 2009-09-29 |
| 6689627 | Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness | Marta Mottura, Alessandra Fischetti, Marco Ferrera, Bernardino Zerbini | 2004-02-10 |
| 6504253 | Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structure | Ubaldo Mastromatteo, Fabrizio Ghironi, Roberto Aina | 2003-01-07 |
| 6498053 | Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material | Ubaldo Mastromatteo, Fabrizio Ghironi, Roberto Aina | 2002-12-24 |