DM

Daniela Morin

SS Stmicroelectronics Sa: 1 patents #2,729 of 4,662Top 60%
HP HP: 1 patents #3,612 of 7,018Top 55%
Overall (All Time): #3,336,618 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7595223 Process for bonding and electrically connecting microsystems integrated in several distinct substrates Ubaldo Mastromatteo, Mauro Bombonati, Marta Mottura, Mauro Marchi 2009-09-29