Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424521 | Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laser | Michele DERAI | 2025-09-23 |
| 12211763 | Enhanced thermal dissipation in flip-chip semiconductor devices using laser direct structuring (LDS) technology | Michele DERAI | 2025-01-28 |
| 11721614 | Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laser | Michele DERAI | 2023-08-08 |
| 10763192 | Method of manufacturing semiconductor devices and corresponding semiconductor device | — | 2020-09-01 |
| 9922947 | Bonding pad structure over active circuitry | Federico Frego, Salvatore Latino | 2018-03-20 |