{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Bonding pad structure over active circuitry", "item": "https://www.patentleaderboard.com/patent/9922947"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonding pad structure over active circuitry

Bonding pad structure over active circuitry

US Patent 9922947 · Granted Mar 20, 2018

Estimated economic value: $9,019,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of coupling semiconductor dice, tool for use therein and corresponding se2025
Method of manufacturing semiconductor devices and corresponding semiconductor de2025
Enhanced thermal dissipation in flip-chip semiconductor devices using laser dire2025
Method of manufacturing semiconductor devices and corresponding semiconductor de2023
Method of manufacturing semiconductor devices and corresponding semiconductor de2020