Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8174120 | Integrated circuit package system with leadframe substrate | Cheonhee Lee | 2012-05-08 |
| 8022531 | Integrated circuit package system using heat slug | Kyungsic Yu, Tae Keun Lee | 2011-09-20 |
| 7851268 | Integrated circuit package system using heat slug | Kyungsic Yu, Tae Keun Lee | 2010-12-14 |
| 7645640 | Integrated circuit package system with leadframe substrate | Cheonhee Lee | 2010-01-12 |