Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854556 | Semiconductor package device and method of manufacturing the same | Yangwon Lee, Seokbong Kim | 2020-12-01 |
| 8022531 | Integrated circuit package system using heat slug | Tae Keun Lee, Youngnam Choi | 2011-09-20 |
| 7851268 | Integrated circuit package system using heat slug | Tae Keun Lee, Youngnam Choi | 2010-12-14 |