Yaojin Lin

SCStats Chippac: 1 patents #282 of 425Top 70%

Singapore, SG: #6,661 of 13,971 inventorsTop 50%

Overall (All Time): #3,209,129 of 4,157,543Top 80%

1 Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
8188590	Integrated circuit package system with post-passivation interconnection and integration	Pandi C. Marimuthu	2012-05-29