Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8779568 | Integrated circuit package system with encapsulation lock | Byung Tai Do | 2014-07-15 |
| 8093693 | Integrated circuit package system with encapsulation lock | Byung Tai Do | 2012-01-10 |
| 8067271 | Integrated circuit package system with encapsulation lock | Byung Tai Do | 2011-11-29 |
| 7919838 | Integrated circuit package system with encapsulation lock and method of manufacture thereof | Byung Tai Do | 2011-04-05 |
| 7414310 | Waferscale package system | Byung Tai Do | 2008-08-19 |