Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553487 | Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation | Xing Zhao, Duk Ju Na | 2020-02-04 |
| 9824923 | Semiconductor device and method of forming conductive pillar having an expanded base | Dzafir Bin Mohd Shariff, Kwong Loon Yam, Yung Kuan Hsiao | 2017-11-21 |
| 9768066 | Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation | Xing Zhao, Duk Ju Na | 2017-09-19 |
| 9257382 | Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer | Duk Ju Na, Chang Beom Yong | 2016-02-09 |
| 9184104 | Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant | Duk Ju Na | 2015-11-10 |
| 8558389 | Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer | Duk Ju Na, Chang Beom Yong | 2013-10-15 |