YY

Yoshihiro Yoneda

SO Sony: 39 patents #733 of 25,231Top 3%
DE Dexerials: 35 patents #4 of 387Top 2%
Sumitomo Electric Industries: 20 patents #1,058 of 21,551Top 5%
MC Mitsui Mining & Smelting Co.: 14 patents #16 of 838Top 2%
SI Sumitomo Electric Device Innovations: 10 patents #7 of 208Top 4%
FL Fujitsu Quantum Devices Limited: 8 patents #4 of 110Top 4%
Fujitsu Limited: 8 patents #3,989 of 24,456Top 20%
SC Shinko Electric Industries Co.: 5 patents #155 of 723Top 25%
ED Eudyna Devices: 4 patents #8 of 80Top 10%
IH Interdigital Patent Holdings: 2 patents #352 of 824Top 45%
AL Aderans Company Limited: 2 patents #14 of 75Top 20%
📍 Kaminokawa, JP: #1 of 99 inventorsTop 2%
Overall (All Time): #7,352 of 4,157,543Top 1%
138
Patents All Time

Issued Patents All Time

Showing 126–138 of 138 patents

Patent #TitleCo-InventorsDate
6791186 Mounting substrate and structure having semiconductor element mounted on substrate Haruo Sorimachi 2004-09-14
6781221 Packaging substrate for electronic elements and electronic device having packaged structure 2004-08-24
6717069 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate 2004-04-06
6700208 Surface mounting substrate having bonding pads in staggered arrangement 2004-03-02
6693337 Semiconductor photodetection device Ikuo Hanawa 2004-02-17
6579737 Optical semiconductor module, its manufacture, reflection film, its manufacture, and laser and optical devices using reflection film Akira Fukushima, Hajime Shoji, Haruhisa Soda 2003-06-17
6448583 Optical semiconductor module, its manufacture, reflection film, its manufacture, and laser and optical devices using reflection film Akira Fukushima, Hajime Shoji, Haruhisa Soda 2002-09-10
6269209 Resin sealed optical module Koji Terada, Taizo Nosaka, Goji Nakagawa, Kazuhiro Tanaka, Kazunori Miura +1 more 2001-07-31
6229711 Flip-chip mount board and flip-chip mount structure with improved mounting reliability 2001-05-08
6049122 Flip chip mounting substrate with resin filled between substrate and semiconductor chip 2000-04-11
5615089 BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate Takashi Ozawa 1997-03-25
4970042 Synthetic fibers having uneven surfaces method for melt-spinning Hiroshi Kakiuchi, Setsuo Fukuhara, Michinobu Fujiwara, Hiroshi Maeda, Yutaka Shirakashi +3 more 1990-11-13
4792489 Synthetic fibers having uneven surfaces and a method of producing same Hiroshi Kakiuchi, Setsuo Fukuhara, Michinobu Fujiwara, Hiroshi Maeda, Yutaka Shirakashi +3 more 1988-12-20