Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7594319 | Electronic-component alignment method | Atsushi Nakamura, Masahisa Hosoi, Kazumasa Osoniwa, Hiroshi Tokunaga | 2009-09-29 |
| 7251883 | Electronic-component alignment method and apparatus therefor | Atsushi Nakamura, Masahisa Hosoi, Kazumasa Osoniwa, Hiroshi Tokunaga | 2007-08-07 |
| 5698068 | Thermocompression bonding equipment | Iwao Ichikawa, Kazuaki Suzuki, Yukio Yamada | 1997-12-16 |
| 5683026 | Pressure-bonding unit and pressure-bonding head unit | Hirokazu Nakayama | 1997-11-04 |
| 5439161 | Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device | Iwao Ichikawa, Kazuaki Suzuki, Yukio Yamada | 1995-08-08 |
| 4733462 | Apparatus for positioning circuit components at predetermined positions and method therefor | — | 1988-03-29 |