| 6618135 |
Laser beam inspection apparatus |
— |
2003-09-09 |
| 5787191 |
Wiring pattern inspection apparatus for printed circuit board |
Hideaki Kawamura, Atsuharu Yamamoto, Yuji Maruyama, Hidehiko Kawakami, Katsuhiro Kondoh |
1998-07-28 |
| 5698068 |
Thermocompression bonding equipment |
Norio Kawatani, Kazuaki Suzuki, Yukio Yamada |
1997-12-16 |
| 5568264 |
Exterior view inspecting apparatus for circuit board |
Shigeki Nakatsuka, Manabu Morioka, Kenji Kato, Takayuki Fujita, Shigetoshi Negishi +1 more |
1996-10-22 |
| 5459795 |
Wiring pattern inspection apparatus for printed circuit board |
Hideaki Kawamura, Atsuharu Yamamoto, Yuji Maruyama, Hidehiko Kawakami, Katsuhiro Kondoh |
1995-10-17 |
| 5439161 |
Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device |
Norio Kawatani, Kazuaki Suzuki, Yukio Yamada |
1995-08-08 |
| 4460108 |
Apparatus for feeding electric circuit elements |
Teruyoshi Noda |
1984-07-17 |
| 4457451 |
Apparatus for feeding electric circuit elements |
— |
1984-07-03 |
| 4451324 |
Apparatus for placing chip type circuit elements on a board |
Kenichiro Kaimori |
1984-05-29 |
| 4345371 |
Method and apparatus for manufacturing hybrid integrated circuits |
Mitsuo Ohsawa, Yoshiteru Noda, Katsumi Yamamoto |
1982-08-24 |
| 4336872 |
Apparatus for transferring parts or the like |
Teruyoshi Noda, Toshio Takahashi |
1982-06-29 |
