Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5937278 | Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer | Makoto Ito, Kenji Ohsawa | 1999-08-10 |
| 5812381 | Lead frame and integrated circuit package using the lead frame | Hiroyuki Shigeta | 1998-09-22 |
| 5481798 | Etching method for forming a lead frame | Kenji Ohsawa, Makoto Ito | 1996-01-09 |
| 5437764 | Lead frame and manufacturing method therefor | Kenji Ohsawa, Makoto Ito | 1995-08-01 |
| 5349238 | Semiconductor device | Kenji Ohsawa, Akira Kojima, Hideyuki Takahashi | 1994-09-20 |