Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12319485 | Die cut opening for multi-layer flexible package | Jacob Donald Prue Branyon, Eugene Smith | 2025-06-03 | |
| 10807779 | Die cut opening for multi-layer flexible package | Jacob Donald Prue Branyon, Eugene Smith | 2020-10-20 | $16,676,000 |
| 10273068 | Die cut opening for multi-layer flexible package | Jacob Donald Prue Branyon, Eugene Smith | 2019-04-30 | $12,792,000 |
| 9421736 | Hybrid pressure sensitive adhesive | Singa D. Tobing, Barry Roland Reese | 2016-08-23 | $19,554,000 |
| 8746490 | Resealable package film | Scott William Huffer | 2014-06-10 | $5,508,000 |