Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Die cut opening for multi-layer flexible package

Die cut opening for multi-layer flexible package

US Patent 12319485 · Granted Jun 3, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible package with reclose region2024
Method of making a plastic film with integrated zipper closure, and plastic bag 2022
Flexible package with reclose region2021
Method of making a plastic film with integrated zipper closure, and plastic bag 2021
Die cut opening for multi-layer flexible package2020
Die cut opening for multi-layer flexible package2020
Die cut opening for multi-layer flexible package2020
Die-cut patterns for blister package2019
Integrated one-way valve with polyol film2019
Flexible package with reclose region2019
Laminate structure with access openings2019
One-way valve score design2019