| 5276073 |
Thermosetting resin composition comprising maleimide, anhydride, epoxy resin and wollastonite |
Ichiro Akutagawa, Kunimitsu Matsuzaki, Toshio Matsuo, Satoru Umeki, Yoshimichi Ono +3 more |
1994-01-04 |
| 5250591 |
Curable adhesive composition |
Takayuki Kawano |
1993-10-05 |
| 5095047 |
Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom |
Osamu Ogitani, Toru Shirose |
1992-03-10 |
| 5061744 |
Resist ink composition |
Osamu Ogitani, Takashi Shimizu, Masao Kawashima, Tuyoshi Kobayashi, Ichiro Akutagawa |
1991-10-29 |
| 5043184 |
Method of forming electrically conducting layer |
Osamu Ogitani, Toru Shirose |
1991-08-27 |
| 5001168 |
Adhesive for surface mounting devices |
Rihei Nagase |
1991-03-19 |
| 4997863 |
Thermosetting resin composition useful for forming insulating layer of multilayer printed wiring board |
Osamu Ogitani, Takashi Shimizu |
1991-03-05 |
| 4985474 |
Hardenable resin composition |
Osamu Ogitani |
1991-01-15 |
| 4205018 |
Radiation curable resin composition |
Kohtaro Nagasawa, Osamu Ogitani |
1980-05-27 |