Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5585421 | Composition dispensable at high speed for bonding electric parts to printed wiring boards | Takayuki Kawano, Hiroaki Minamoto | 1996-12-17 |
| 5244939 | Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition | Akira Yasuda | 1993-09-14 |
| 5218015 | Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition based on surface treated zeolites | Akira Yasuda | 1993-06-08 |
| 5077355 | Epoxy resin/imidazole/polyphenol adduct as epoxy curing agent | Akira Yasuda, Masao Kawashima | 1991-12-31 |
| 5001168 | Adhesive for surface mounting devices | Ryuichi Fujii | 1991-03-19 |