Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106996 | Collet structure and semiconductor fabricating apparatus including the same | Soo Hyuk Kim, Byeong Ho Lee, Tae Hwan Lim | 2024-10-01 |
| 7546941 | Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same | Hai Ju No, Hee Sung Kim, Sang Nam Go, Tae Hyung Kim | 2009-06-16 |