Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7546941 | Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same | Hee Sung Kim, Jung Bum Woo, Sang Nam Go, Tae Hyung Kim | 2009-06-16 |