Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825732 | Method of producing stresses in a semiconductor wafer | Wolfram Drescher | 2020-11-03 |
| 10580699 | Method and device for the production of wafers with a pre-defined break initiation point | Wolfram Drescher | 2020-03-03 |
| 10304738 | Method and device for the production of wafers with a pre-defined break initiation point | Wolfram Drescher | 2019-05-28 |
| 10269643 | Method and device for the production of wafers with a pre-defined break initiation point | Wolfram Drescher | 2019-04-23 |
| 10029277 | Method of producing large-scale layers of solid material | Jan Richter, Wolfram Drescher | 2018-07-24 |
| 9754810 | Method for the production of a wafer with a carrier unit | — | 2017-09-05 |
| 8877077 | Method for producing thin, free-standing layers of solid state materials with structured surfaces | — | 2014-11-04 |
| 8440129 | Production of free-standing solid state layers by thermal processing of substrates with a polymer | Christian Pfeffer | 2013-05-14 |