Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094727 | Method forming a semiconductor package device | Yi-Hung Chien, Chun-Ying Wang, Te-Wei Chen, Bing Wu | 2024-09-17 |
| 9991196 | Printed circuit board and method of fabricating an element | Shu-Ying HUANG, Te-Wei Chen | 2018-06-05 |