Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12094727 | Method forming a semiconductor package device | Yi-Hung Chien, Chun-Ying Wang, Te-Wei Chen, Hsiu-Yuan CHEN | 2024-09-17 | $5,909,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12094727 | Method forming a semiconductor package device | Yi-Hung Chien, Chun-Ying Wang, Te-Wei Chen, Hsiu-Yuan CHEN | 2024-09-17 | $5,909,000 |