Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418000 | Stacked package structure and stacked packaging method for chip | — | 2025-09-16 |
| 11735503 | Method of manufacturing chip packaging structure with dissipation layer, flange and sealing pin | — | 2023-08-22 |
| 11462510 | Stacked package structure and stacked packaging method for chip | — | 2022-10-04 |
| 11239140 | Chip packaging structure with heat dissipation layer, flange and sealing pin | — | 2022-02-01 |
| 10763241 | Stacked package structure and stacked packaging method for chip | — | 2020-09-01 |
| 10741481 | Integrated package assembly for switching regulator | Jiaming Ye | 2020-08-11 |
| 10734249 | Package structure and method thereof | — | 2020-08-04 |
| 10319608 | Package structure and method therof | — | 2019-06-11 |
| 10128221 | Package assembly having interconnect for stacked electronic devices and method for manufacturing the same | Jiaming Ye | 2018-11-13 |
| 10043738 | Integrated package assembly for switching regulator | Jiaming Ye | 2018-08-07 |
| 9786521 | Chip package method for reducing chip leakage current | — | 2017-10-10 |
| 9780081 | Chip package structure and manufacturing method therefor | — | 2017-10-03 |
| 9735122 | Flip chip package structure and fabrication process thereof | — | 2017-08-15 |
| 9699918 | Package assembly and method for manufacturing the same | Jiaming Ye | 2017-07-04 |
| 9653355 | Flip chip package structure and fabrication process thereof | — | 2017-05-16 |
| 9595453 | Chip package method and package assembly | Jiaming Ye | 2017-03-14 |
| 9373567 | Lead frame, manufacture method and package structure thereof | — | 2016-06-21 |
| 9324633 | Multi-level package assembly having conductive vias coupled to chip carrier for each level and method for manufacturing the same | — | 2016-04-26 |
| 9245872 | Flip-chip package structure and method for an integrated switching power supply | — | 2016-01-26 |
| 9136248 | Multi-chip stacked package and method for forming the same | — | 2015-09-15 |
| 9136207 | Chip packaging structure of a plurality of assemblies | — | 2015-09-15 |
| 9129947 | Multi-chip packaging structure and method | Wei-Jen Chen | 2015-09-08 |
| 9123629 | Chip package and method for forming the same | — | 2015-09-01 |
| 9054088 | Multi-component chip packaging structure | — | 2015-06-09 |
| 9024440 | Flip-chip package structure and method for an integrated switching power supply | — | 2015-05-05 |