Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866273 | Lead frame and semiconductor package structure thereof | — | 2014-10-21 |
| 8866283 | Chip package structure and method of making the same | Wei-Ling Chen | 2014-10-21 |
| 8853838 | Lead frame and flip packaging device thereof | — | 2014-10-07 |
| 8836093 | Lead frame and flip chip package device thereof | — | 2014-09-16 |
| 8294256 | Chip package structure and method of making the same | Wei-En Chen | 2012-10-23 |
| 8008128 | Thin quad flat package with no leads (QFN) fabrication methods | Zhining Li, Xaiolan Jiang | 2011-08-30 |
| 7745261 | Chip scale package fabrication methods | Jun Guo | 2010-06-29 |
| 7713784 | Thin quad flat package with no leads (QFN) fabrication methods | Zhining Li, Xiaolan Jiang | 2010-05-11 |
| D606083 | User interface for a display screen | Ryan Jeremy Parker, Bryan T. Agnetta, Liang Chen | 2009-12-15 |
| D606081 | User interface for a display screen | Ryan Jeremy Parker, Bryan T. Agnetta, Liang Chen | 2009-12-15 |
| D606082 | User interface for a display screen | Ryan Jeremy Parker, Bryan T. Agnetta, Liang Chen | 2009-12-15 |
| 7517726 | Wire bonded chip scale package fabrication methods | Jun Guo | 2009-04-14 |