Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6309953 | Process for producing a semiconductor device with a roughened semiconductor surface | Helmut Fischer, Reinhard Sedlmeier, Ernst Nirschl | 2001-10-30 |
| 6281031 | Method of severing a semiconductor wafer | Josef Maurer | 2001-08-28 |
| 6140248 | Process for producing a semiconductor device with a roughened semiconductor surface | Helmut Fischer, Reinhard Sedlmeier, Ernst Nirschl | 2000-10-31 |