Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11059966 | Liquid epoxy resin composition for sealing, and electronic component device | Hisato Takahashi, Makoto Kunimi, Kohji Hori | 2021-07-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11059966 | Liquid epoxy resin composition for sealing, and electronic component device | Hisato Takahashi, Makoto Kunimi, Kohji Hori | 2021-07-13 |