Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11059966 | Liquid epoxy resin composition for sealing, and electronic component device | Naoyuki Nojiri, Hisato Takahashi, Kohji Hori | 2021-07-13 |
| 7241816 | Expandable styrene resin particles, expandable beads, and foamed article | Tetsuya Katou, Makoto Saitou, Hiroshi Nakaguki, Toshio Akima | 2007-07-10 |
| 6797733 | Expandable styrene resin particles, expandable beads, and foamed article | Tetsuya Katou, Makoto Saitou, Hiroshi Nakaguki, Toshio Akima | 2004-09-28 |