Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11617264 | Interconnect substrate and method of making the same | — | 2023-03-28 |
| 10887985 | Wiring substrate | Natsuko Kitajo, Izumi Tanaka | 2021-01-05 |
| 10306759 | Wiring substrate | Natsuko Kitajo, Izumi Tanaka | 2019-05-28 |
| 9711461 | Wiring substrate and semiconductor device | Natsuko Kitajo, Izumi Tanaka | 2017-07-18 |
| 8561293 | Method for manufacturing wiring board | Izumi Tanaka | 2013-10-22 |
| 8196296 | Method for manufacturing wiring board | Izumi Tanaka | 2012-06-12 |
| 8129626 | Multilayer wiring substrate with a reinforcing layer for preventing a warp | Natsuko Ueda | 2012-03-06 |
| 8034188 | Method for cleaning surface of resin layer | Yoji Asahi | 2011-10-11 |