Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11256475 | Vehicle control device and vehicle travel control system | Yuki Ito, Yuta Morikawa, Naoki Yamamuro, Yuki TATSUMOTO | 2022-02-22 |
| 11227813 | Electronic apparatus | Takayuki Matsumoto, Tadaaki Katsuyama | 2022-01-18 |
| 10988129 | Operating portion control device, vehicle control system, and operating portion control method | Yuta Morikawa, Yuki Ito, Naoki Yamamuro, Yuki TATSUMOTO | 2021-04-27 |
| 10986732 | Laminated circuit board, and electronic component | Takayuki Matsumoto | 2021-04-20 |
| 10943857 | Substrate with multi-layer resin structure and semiconductor device including the substrate | Kentaro Kaneko, Harunobu Sato, Junichi Nakamura, Koji Watanabe | 2021-03-09 |
| 10854373 | Inductor device | Kiyokazu Sato, Osamu Hoshino | 2020-12-01 |
| 10818579 | Lead frame and electronic component device | Shintaro Hayashi, Kentaro Kaneko, Misaki Imai | 2020-10-27 |
| 10395810 | Inductor | Atsushi Nakamura, Kiyokazu Sato, Yasuyoshi Horikawa | 2019-08-27 |
| 10062490 | Method of manufacturing an inductor | Yasuyoshi Horikawa, Kazuyuki Okita, Yukihiro Miyasaka | 2018-08-28 |
| 10014100 | Coil substrate, method of manufacturing coil substrate and inductor | Atsushi Nakamura, Yoichi Sasada | 2018-07-03 |
| 9966184 | Inductor and coil substrate | Atsushi Nakamura, Kiyokazu Sato | 2018-05-08 |
| 9721884 | Inductor device and method of manufacturing the same | Yasuyoshi Horikawa, Tatsuaki Denda | 2017-08-01 |
| 9615461 | Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module | Atsushi Nakamura, Takayuki Matsumoto | 2017-04-04 |
| 9595384 | Coil substrate, method for manufacturing coil substrate, and inductor | Atsushi Nakamura, Yoichi Sasada | 2017-03-14 |
| 9406432 | Inductor and coil substrate | Atsushi Nakamura, Kiyokazu Sato | 2016-08-02 |
| 9396874 | Method of manufacturing coil substrate and inductor | Atsushi Nakamura, Yoichi Sasada | 2016-07-19 |
| 9392692 | Wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring substrate | Atsushi Nakamura, Takayuki Matsumoto | 2016-07-12 |
| 9276185 | Light-emitting element mounting package having protruded wiring and recessed wiring, and light-emitting element package | Atsushi Nakamura, Takayuki Matsumoto | 2016-03-01 |
| 9224933 | Light emitting device package and package for mounting light emitting device | Atsushi Nakamura, Takayuki Matsumoto | 2015-12-29 |
| 9166132 | Light-emitting element mounting package having heat radiation route, manufacturing method of the same, and light-emitting element package | Atsushi Nakamura, Takayuki Matsumoto | 2015-10-20 |
| 9167689 | Wiring substrate and method for manufacturing wiring substrate | Atsushi Nakamura, Takayuki Matsumoto, Kiyokazu Sato, Osamu Hoshino | 2015-10-20 |
| 9147518 | Inductor and coil substrate | Atsushi Nakamura, Takayuki Matsumoto | 2015-09-29 |
| 9101048 | Printed wiring board and method of manufacturing printed wiring board | Atsushi Nakamura, Takayuki Matsumoto | 2015-08-04 |