Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923282 | Wiring substrate | — | 2024-03-05 |
| 11647584 | Circuit board, and electronic device | Tsukasa Nakanishi, Koji Watanabe, Jun Izuoka | 2023-05-09 |
| 11398432 | Wiring substrate and electronic device | Tsukasa Nakanishi | 2022-07-26 |
| 10964553 | Manufacturing method of semiconductor device and semiconductor device | — | 2021-03-30 |
| 10586758 | Substrate-with-support | — | 2020-03-10 |
| 10096539 | Lead frame and electronic component device | Naoya Sakai | 2018-10-09 |
| 9972560 | Lead frame and semiconductor device | Hideki Matsuzawa, Masayuki Okushi, Naoya Sakai | 2018-05-15 |
| 9698084 | Semiconductor device and lead frame having two leads welded together | Naoya Sakai, Hideki Kobayashi, Masayuki Okushi | 2017-07-04 |
| 7259044 | Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same | Hideto Tanaka | 2007-08-21 |
| 7237319 | Method of manufacturing a plane coil | Hitoshi Yoshikawa | 2007-07-03 |
| 6875630 | Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same | Hideto Tanaka | 2005-04-05 |
| 6797543 | Process for manufacturing IC card | Hirokazu Tsukioka, Shintaro Hayashi | 2004-09-28 |
| 6631847 | IC card, antenna for IC card, and antenna frame therefor | Hirokazu Tsukioka, Hirofumi Haniuda | 2003-10-14 |
| 6630370 | Process for manufacturing IC card | Hirokazu Tsukioka, Shintaro Hayashi | 2003-10-07 |