Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837530 | Lead frame with a support portion having a through hole over a heat dissipation plate, semiconductor device, and manufacturing method of lead frame | Koichi Ishida, Mitsuori Yoshimi | 2023-12-05 |
| 11647584 | Circuit board, and electronic device | Tetsuichiro Kasahara, Tsukasa Nakanishi, Koji Watanabe | 2023-05-09 |