Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8304872 | Lead frame, method for manufacturing the same and semiconductor device | Muneaki Kure, Akemi Nozaki | 2012-11-06 |
| 8283759 | Lead frame having outer leads coated with a four layer plating | Seishi Oida, Takahiro Nakano, Yoshito Miyahara, Takashi Yoshie, Harunobu Satou +1 more | 2012-10-09 |
| 7524702 | Conductor substrate, semiconductor device and production method thereof | Yoshihito Miyahara, Muneaki Kure | 2009-04-28 |
| 7408248 | Lead frame for semiconductor device | Takashi Yoshie, Koichi Kadosaki | 2008-08-05 |
| 7329944 | Leadframe for semiconductor device | Harunobu Sato, Muneaki Kure | 2008-02-12 |
| 7301226 | Conductor substrate, semiconductor device and production method thereof | Yoshihito Miyahara, Muneaki Kure | 2007-11-27 |
| 7190057 | Packaging component and semiconductor package | Takashi Yoshie, Harunobu Sato, Yoshihito Miyahara | 2007-03-13 |
| 6593643 | Semiconductor device lead frame | Takashi Yoshie, Harunobu Sato | 2003-07-15 |