Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9018761 | Semiconductor device | Kouji Oomori | 2015-04-28 |
| 8283759 | Lead frame having outer leads coated with a four layer plating | Takahiro Nakano, Yoshito Miyahara, Takashi Yoshie, Harunobu Satou, Kouichi Kadosaki +1 more | 2012-10-09 |
| 6917118 | Semiconductor device | Kouji Omori, Masayuki Yukawa, Toshiyuki Nakazawa, Takashi Ogawa, Shigeki Sakaguchi | 2005-07-12 |
| 6853077 | Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same | Sigeki Sakaguchi, Koji Ohmori, Kenrou Jitumori | 2005-02-08 |
| 6291274 | Resin molded semiconductor device and method for manufacturing the same | Yukio Yamaguchi, Nobuhiro Suematsu | 2001-09-18 |
| 6258314 | Method for manufacturing resin-molded semiconductor device | Yukio Yamaguchi, Nobuhiro Suematsu, Takeshi Morikawa, Yuichiro Yamada | 2001-07-10 |
| 6126885 | Method for manufacturing resin-molded semiconductor device | Yukio Yamaguchi, Nobuhiro Suematsu, Takeshi Morikawa, Yuichiro Yamada | 2000-10-03 |