Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6687988 | Method for forming pin-form wires and the like | Kazuo Sugiura | 2004-02-10 |
| 6632703 | Method and apparatus for positioning a semiconductor pellet | Hiroshi Ushiki | 2003-10-14 |
| 6581283 | Method for forming pin-form wires and the like | Kazuo Sugiura, Fumihiko Kato, Yasuyuki Komachi | 2003-06-24 |
| 6505823 | Apparatus for positioning a semiconductor pellet | Hiroshi Ushiki | 2003-01-14 |
| 6193130 | Bump bonding apparatus | Hiroshi Ushiki, Koichi Takahashi | 2001-02-27 |
| 5953624 | Bump forming method | Akio Bando, Motohiko Katoh | 1999-09-14 |
| 5848868 | Wafer conveying apparatus | Yasunobu Suzuki, Kazuhiro Imai, Tetsuya Kobaru | 1998-12-15 |