Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5953624 | Bump forming method | Motohiko Katoh, Hirofumi Moroe | 1999-09-14 |
| 5205460 | Bonding apparatus | Koji Sato | 1993-04-27 |
| 5156318 | Ultrasonic bonding apparatus for bonding a semiconductor device to a tab tape | Yasushi Suzuki | 1992-10-20 |
| 4887758 | Apparatus for connecting external leads | Yasunobu Suzuki, Motohiko Kato, Hisao Ishida, Akihiro Nishimura | 1989-12-19 |