Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11111877 | Piston for internal combustion engine | Chiaki Taresawa, Nobuyuki Fujiwara, Kunihiko KOBAYASHI | 2021-09-07 |
| 10155755 | Quinuclidine derivative | Tohru MIZUSHIMA, Yasunobu Yamashita | 2018-12-18 |
| 9520522 | Method of manufacturing solar cell module | Tomoyoshi Furihata, Atsuo Ito, Hiroto Ohwada, Hyung Bae Kim, Sumio Sekiyama +2 more | 2016-12-13 |
| 9385253 | Method of manufacturing solar cell module | Tomoyoshi Furihata, Atsuo Ito, Hiroto Ohwada, Hyung Bae Kim, Sumio Sekiyama +2 more | 2016-07-05 |
| 9299875 | Manufacture of solar cell module | Tomoyoshi Furihata, Hiroto Ohwada, Junichi Tsukada, Atsuo Ito, Atsushi Yaginuma +1 more | 2016-03-29 |
| 9221786 | 2-fluorophenyl propionic acid derivatives | Toru Mizushima, Masami Otsuka, Yoshinari Okamoto | 2015-12-29 |
| 8999743 | Manufacture of solar cell module | Tomoyoshi Furihata, Hiroto Ohwada, Masahiro Hinata | 2015-04-07 |
| 8592030 | Silicone adhesive for semiconductor element | Kei Miyoshi, Toshiyuki Ozai, Yoshinori Ogawa | 2013-11-26 |
| 8431614 | Loxoprofen derivative and pharmaceutical preparation containing the same | Toru Mizushima, Masami Ohtsuka, Yoshinari Okamoto | 2013-04-30 |
| 7951891 | Silicone resin composition for die bonding | Kei Miyoshi, Tomoyuki Goto | 2011-05-31 |
| 7737212 | Heat conductive silicone composition | Toshiyuki Ozai | 2010-06-15 |
| 7705104 | Addition curable silicon resin composition for light emitting diode | Kei Miyoshi | 2010-04-27 |
| 7425373 | Primer composition | Noriyuki Meguriya | 2008-09-16 |
| 7271215 | Addition reaction-curable liquid silicone rubber compositions and process of preparing same | Masayuki Ikeno, Shigeki Shudo, Yujiro Taira | 2007-09-18 |
| 6841596 | Release agent for silicone rubber molding molds and molding method | Noriyuki Meguriya, Syuuichi Azechi, Makoto Kusama | 2005-01-11 |
| 6780518 | Silicone rubber adhesive composition and integrally molded article of silicone rubber and thermoplastic resin | Syuuichi Azechi | 2004-08-24 |