Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777327 | Method of barrier metal surface treatment prior to Cu deposition to improve adhesion and trench filling characteristics | Jer-Shen Maa, David R. Evans, Sheng Teng Hsu | 2004-08-17 |
| 6774004 | Nano-scale resistance cross-point memory array | Sheng Teng Hsu, Wei-Wei Zhuang, Fengyan Zhang | 2004-08-10 |
| 6746910 | Method of fabricating self-aligned cross-point memory array | Sheng Teng Hsu, Wei-Wei Zhuang | 2004-06-08 |
| 6723643 | Method for chemical mechanical polishing of thin films using end-point indicator structures | David R. Evans, Allen Burmaster | 2004-04-20 |
| 6720031 | Method of controlling the initial growth of CVD copper films by surface treatment of barrier metals films | David R. Evans, Sheng Teng Hsu | 2004-04-13 |
| 6716744 | Ultra thin tungsten metal films used as adhesion promoter between barrier metals and copper | David R. Evans, Sheng Teng Hsu | 2004-04-06 |
| 6709942 | Method of fabricating magnetic yoke structures in MRAM devices | Sheng Teng Hsu | 2004-03-23 |
| 6686273 | Method of fabricating copper interconnects with very low-k inter-level insulator | Sheng Teng Hsu | 2004-02-03 |
| 6660628 | Method of MOCVD Ti-based barrier metal thin films with tetrakis (methylethylamino) titanium with octane | Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2003-12-09 |
| 6654210 | Solid-state inductor and method for same | Sheng Teng Hsu, Wei-Wei Zhuang | 2003-11-25 |
| 6642138 | Process of making dual damascene structures using a sacrificial polymer | Sheng Teng Hsu | 2003-11-04 |
| 6579793 | Method of achieving high adhesion of CVD copper thin films on TaN Substrates | Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2003-06-17 |
| 6555467 | Method of making air gaps copper interconnect | Sheng Teng Hsu | 2003-04-29 |
| 6548849 | Magnetic yoke structures in MRAM devices to reduce programming power consumption and a method to make the same | Sheng Teng Hsu | 2003-04-15 |
| 6509268 | Thermal densification in the early stages of copper MOCVD for depositing high quality Cu films with good adhesion and trench filling characteristics | David R. Evans, Sheng Teng Hsu | 2003-01-21 |
| 6475813 | MOCVD and annealing processes for C-axis oriented ferroelectric thin films | Tingkai Li, Sheng Teng Hsu | 2002-11-05 |
| 6416936 | Top surface imaging technique for top pole tip width control in magnetoresistive read/write head processing | Michael J. Jennison | 2002-07-09 |
| 6194310 | Method of forming amorphous conducting diffusion barriers | Sheng Teng Hsu, Douglas J. Tweet, David R. Evans | 2001-02-27 |
| 6156487 | Top surface imaging technique for top pole tip width control in magnetoresistive read/write head processing | Michael J. Jennison | 2000-12-05 |
| 6099699 | Thin encapsulation process for making thin film read/write heads | Ann I. Kang, Jerome S. Marcelino | 2000-08-08 |
| 5873977 | Dry etching of layer structure oxides | Seshu B. Desu | 1999-02-23 |
| 5496437 | Reactive ion etching of lead zirconate titanate and ruthenium oxide thin films | Seshu B. Desu, Dilip Vijay | 1996-03-05 |
| 5382320 | Reactive ion etching of lead zirconate titanate and ruthenium oxide thin films using CHClFCF.sub.3 or CHCl.sub.2 CF.sub.3 as an etch gas | Seshu B. Desu | 1995-01-17 |