Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12111350 | Method and apparatus for RF built-in test system for a beamforming module in a radar system | Wei-Min Kuo, Viktor Novozhilov, Phuoc Nguyen, Michael Nilsson | 2024-10-08 |
| 11307440 | On-chip high capacitance termination for transmitters | Stephen B. Krasulick, Damien Lambert, Guoliang Li | 2022-04-19 |
| 11223348 | Multi-level output driver with adjustable pre-distortion capability | Phuoc Nguyen, Viktor Novozhilov, Michael Nilsson, Wei-Min Kuo | 2022-01-11 |
| 10678073 | On-chip high capacitance termination for transmitters | Stephen B. Krasulick, Damien Lambert, Guoliang Li | 2020-06-09 |
| 10587255 | Multi-level output driver with adjustable pre-distortion capability | Phuoc Nguyen, Viktor Novozhilov, Michael Nilsson, Wei-Min Kuo | 2020-03-10 |
| 8703540 | Chip-scale semiconductor die packaging method | Darren Jay Walworth | 2014-04-22 |
| 8593221 | Methods and circuits for common mode stability and bandwidth broadening in transistor amplifiers | Liping Zhang, Thomas Krawczyk, David A. Rowe | 2013-11-26 |
| 8367469 | Chip-scale semiconductor die packaging method | Darren Jay Walworth | 2013-02-05 |
| 8150270 | Compact high-speed modulator driver method and apparatus | — | 2012-04-03 |
| 8093714 | Chip assembly with chip-scale packaging | Darren Jay Walworth | 2012-01-10 |
| 6738173 | Limiting amplifier modulator driver | Richard N. Nottenburg | 2004-05-18 |