Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923399 | Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturing | Deyuan Xiao, Roger Lee | 2021-02-16 |
| 9922878 | Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturing | De Yuan Xiao, Roger Lee | 2018-03-20 |
| 9673060 | System and method for integrated circuits with cylindrical gate structures | De Yuan Xiao, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2017-06-06 |
| 9373694 | System and method for integrated circuits with cylindrical gate structures | De Yuan Xiao, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2016-06-21 |
| 9224812 | System and method for integrated circuits with cylindrical gate structures | De Yuan Xiao, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2015-12-29 |
| 9202762 | Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturing | Deyuan Xiao, Roger Lee | 2015-12-01 |
| 8884363 | System and method for integrated circuits with cylindrical gate structures | De Yuan Xiao, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2014-11-11 |
| 8581366 | Method and system for forming conductive bumping with copper interconnection | De Yuan Xiao | 2013-11-12 |
| 8293635 | Method and system for forming conductive bumping with copper interconnection | De Yuan Xiao | 2012-10-23 |
| 8053907 | Method and system for forming conductive bumping with copper interconnection | De Yuan Xiao | 2011-11-08 |