Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922878 | Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturing | Guo Qing Chen, Roger Lee | 2018-03-20 |
| 9853026 | FinFET device and fabrication method thereof | — | 2017-12-26 |
| 9673060 | System and method for integrated circuits with cylindrical gate structures | Guo Qing Chen, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2017-06-06 |
| 9437709 | Semiconductor device and fabrication method thereof | — | 2016-09-06 |
| 9373694 | System and method for integrated circuits with cylindrical gate structures | Guo Qing Chen, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2016-06-21 |
| 9269772 | Semiconductor device and fabrication method thereof | — | 2016-02-23 |
| 9224812 | System and method for integrated circuits with cylindrical gate structures | Guo Qing Chen, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2015-12-29 |
| 9209289 | Semiconductor device and fabrication method thereof | — | 2015-12-08 |
| 9136183 | Transistor device and fabrication method | — | 2015-09-15 |
| 9093354 | Three-dimensional quantum well transistor | — | 2015-07-28 |
| 9029222 | Three-dimensional quantum well transistor and fabrication method | — | 2015-05-12 |
| 8889510 | Surrounding stacked gate multi-gate FET structure nonvolatile memory device | Lily Jiang, Gary Chen, Roger Lee | 2014-11-18 |
| 8884363 | System and method for integrated circuits with cylindrical gate structures | Guo Qing Chen, Roger Lee, Chin Fu Yen, Su Xing, Xiao Lu Huang +1 more | 2014-11-11 |
| 8581366 | Method and system for forming conductive bumping with copper interconnection | Guo Qing Chen | 2013-11-12 |
| 8471323 | 3-D electrically programmable and erasable single-transistor non-volatile semiconductor memory device | Gary Chen, Roger Lee | 2013-06-25 |
| 8293635 | Method and system for forming conductive bumping with copper interconnection | Guo Qing Chen | 2012-10-23 |
| 8053907 | Method and system for forming conductive bumping with copper interconnection | Guo Qing Chen | 2011-11-08 |