Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777458 | Method of filling a via hole and apparatus for performing the same | Yoon Ki SA | 2020-09-15 |
| 10711228 | Substrate treating apparatus and substrate treating method | Miyoung Jo, YeRim Yeon, Anton Koriakin | 2020-07-14 |