Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691778 | Multiheight contact via structures for a multilevel interconnect structure | Keisuke Izumi, Hiroaki Iuchi, Kentaro Sera, Akio Yanai | 2017-06-27 |
| 9236392 | Multiheight electrically conductive via contacts for a multilevel interconnect structure | Keisuke Izumi, Hiroaki Iuchi, Kentaro Sera, Akio Yanai | 2016-01-12 |