Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2023-05-02 |
| 11532572 | Semiconductor package | Joo Hwan Jung, Jung Chul Gong, Yong Ho Baek, Young Sik Hur | 2022-12-20 |
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2021-11-23 |
| 11075175 | Semiconductor package | Joo Hwan Jung, Jung Chul Gong, Yong Ho Baek, Young Sik Hur | 2021-07-27 |
| 10833070 | Fan-out semiconductor package module | Jung Chul Gong, Yong Ho Baek, Young Sik Hur, Joo Hwan Jung | 2020-11-10 |
| 10403562 | Fan-out semiconductor package module | Yong Ho Baek, Joo Hwan Jung, Young Sik Hur, Jung Chul Gong | 2019-09-03 |